Semiconductor Equipment
Anonymized application scenario: High-purity alumina end-effector for wafer handling
Representative alumina end-effector concept for 300 mm wafer handling, focusing on particle contamination, thermal deformation and long-span flatness.
Anonymized application scenario: This representative engineering case is based on typical design, material and machining requirements. It does not represent a specific customer project. Values below are engineering targets, not measured customer results.
Application overview
This representative scenario describes an engineering approach for replacing an aluminum end-effector with high-purity alumina where particle contamination and thermal deformation affect 300 mm wafer handling.
Engineering scope
This page explains material selection, process routing and inspection methods. It is not a performance commitment for a specific customer project.
Challenge
In a representative 300 mm wafer-handling scenario, an aluminum arm can generate particles and thermally deform. Typical engineering requirements include flatness ≤0.005 mm over a 350 mm span, overall thickness tolerance ±0.002 mm, surface roughness Ra ≤0.2 μm, and alumina purity of at least 99.8%.
Solution
The representative approach uses 99.8% high-purity alumina for dielectric strength, plasma resistance and low thermal expansion. Processing includes 5-axis CNC diamond grinding of vacuum channels and lightweight pockets, plus double-disc lapping for flatness. Inspection may include CMM, ICP-OES purity analysis and cleanroom visual checks, subject to project requirements.
Process
Drawing/DFM review → high-purity alumina blank → 5-axis CNC diamond grinding → double-disc lapping → cleaning and clean packaging → CMM/purity/visual inspection.
Inspection & compliance approach
- CMM dimensional inspection per drawing; report available on request.
- Surface roughness measured with a profilometer; Ra targets are project-specific.
- Lot-specific material certificate; material grade confirmed against the drawing.
- Life validation is application-specific; the test protocol is agreed per project.
- RoHS/REACH declarations are reviewed per material lot where required; no blanket certificate is implied.
Engineering targets
Long-span flatness target
≤0.005mm
Engineering target, project-specific
Thickness tolerance target
±0.002mm
Engineering target, project-specific
Surface roughness target
Ra ≤0.2μm
Engineering target, project-specific
Related products
NDA & Confidentiality
This case is published as an anonymized application scenario. Customer names, logos and proprietary drawings are not disclosed. Values are engineering targets, not measured customer results.
Have a Similar Precision Ceramic Challenge?
Upload your STEP or PDF drawing for a DFM review and a project quote.
Get a Quote