Semiconductor Equipment
Application case: HTCC ceramic vacuum package
Anonymized application case for hermetic ceramic packages used in MEMS/optical devices.
Status
This is a draft case. Customer approval and project data are pending; it is not published.
Approach
- Material: HTCC alumina
- Structure: multilayer co-fired, metallized, hermetic
- Focus: layer registration, sintering distortion, sealing surface
- Inspection: dimensions, appearance, hermeticity as required
Challenge
Multilayer co-fired ceramics shrink and warp during sintering; sealing faces and layer registration must be controlled.
Solution
Evaluate lamination, sintering profile, metallization and sealing-face machining; parameters to be confirmed by project.
Process
Drawing review → material/stack evaluation → sintering and machining → inspection → packaging